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Has anyone tried rework of lead-free assemblies? Any issues? Is there a solution for achieving high temperatures without adversely affecting board and component, considering the fact that higher temperatures are needed in rework machine compared to the reflow oven. I have problems such as a charred component-substrate (FR4 material) and sometimes insufficient reflow & board warpage (even with 62-mil boards). Please help me with that.
John Farrugia
2017/3/3 4:04:03
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