Turnkey PCB Assembly Solutions
From Prototype to Mass Production

- Engineers validate PCB design files (Gerber, BOM, CPL) against manufacturing capabilities.\n- Perform Design for Manufacturability (DFM) checks for component spacing, pad sizes, and thermal management.

- Risk Mitigation: Prevents costly redesigns by flagging layout errors (e.g., solder bridges, insufficient clearances).\n- Cost Optimization: Recommends design tweaks to reduce material waste and improve yield rates.\n- Compliance: Ensures adherence to IPC standards (e.g., IPC-A-610) for industry-grade quality.

- Source components from certified suppliers using real-time inventory databases.\n- Authenticate parts via batch-code tracing, X-ray inspection, or third-party lab testing.

- Genuine Parts Guarantee: Eliminates counterfeit risks with supplier audits and COC (Certificate of Conformance).\n- Supply Chain Resilience: Multi-sourcing strategies prevent delays for obsolete or long-lead-time components.\n- Cost Transparency: Price-match commitments and bulk-order discounts.

- Use a stencil and precision printer to evenly coat solder paste on PCB pads.\n- Adjust printing parameters (pressure, speed) to ensure solder paste thickness and coverage accuracy.

- The basis of welding quality: accurate solder paste quantity reduces defects such as cold solder joints or bridging.\n- Process stability: parameter standardization ensures consistency in batch production.

- Detect solder paste thickness, volume and position deviation through 3D optical scanning.\n- Real-time feedback data to calibrate printer parameters.

- Defect prevention: intercept solder paste anomalies before soldering to avoid subsequent rework.\n- Process control: digital monitoring improves process capability (CPK).

- Apply solder paste via stencil printing.

- Place components using high-precision pick-and-place machines.

- Reflow soldering in controlled-temperature ovens.

- Precision: ±0.025mm placement accuracy for 0201 packages and micro-BGAs.

- Process Control: Solder paste inspection (SPI) and AOI (Automated Optical Inspection) ensure defect rates <0.1%.

- Traceability: Barcode tracking for every PCB panel.

- The temperature curve is set according to the characteristics of the solder paste, divided into three stages: preheating, reflow, and cooling.

- Precisely control the peak temperature (usually 220–250°C) to form reliable solder joints.

- Welding reliability: avoid cold welding or overheating to ensure the stability of electrical connections.

- Consistency: Temperature curve monitoring ensures uniform soldering quality for each batch.

- Perform electrical tests (such as ICT) and basic functional verification on the first sample.

- Compare with design specifications and confirm key parameters (voltage, signal integrity).

- Early risk exposure: Discover design or process problems in the early stages of production.

- Fast iteration: Reduce rectification costs after mass production.

- Detect solder joint quality, component offset or polarity errors through multi-angle cameras.

- Machine learning algorithms automatically classify defects (such as missing parts and tombstones).

- Comprehensive inspection: Covers more than 99% of visible defects and reduces manual omissions.

- Quality dataization: Generates inspection reports to support continuous process optimization.

- Insert leads into drilled holes manually or via automated insertion machines.

- Wave soldering or selective soldering for robust connections.

- Durability: Mechanical strength testing for high-stress applications (e.g., automotive, industrial).\n

- Consistency: Automated systems eliminate human error in pin alignment.

- Use X-ray fluoroscopy to detect hidden solder joints (such as BGA, QFN).\n

- Analyze whether the solder joint bubble rate and filling integrity meet IPC standards.

- Non-destructive testing: Ensure the internal quality of invisible solder joints.\n- High-precision analysis: Quantify defect indicators (such as bubble rate <25%) to ensure long-term reliability.

- Perform environmental testing (high and low temperature, vibration), aging testing and full functional verification.

- Simulate terminal usage scenarios to ensure stable operation of the product in actual applications.

- Performance compliance: 100% meets customer specifications.

- Durability assurance: Verify product life cycle through accelerated life testing.

- Visual inspection under magnification for cosmetic flaws.

- Anti-static ESD packaging with moisture barrier bags.

- Labeling and serialization for logistics tracking.

- Aesthetic Standards: Reject boards with scratches, discoloration, or misalignment.

- Shipping Safety: MIL-STD-2073-compliant packaging to prevent transit damage.

- Delivery Tracking: Real-time logistics updates via integrated courier APIs.