Premium PCB Capability

Category	Capability	Details	Graphical description
Layers	1-32	The number of layers refers to the number of electrical layers in the PCB (the number of copper layers)	-
Laminated Structure	4 layers, 6 layers, 8 layers, 10 layers	The laminated structure shown is the common structure recommended by our company	ALLPCB Standard Stack Up
Material Type	FR-4	Shengyi: Tg140/150/170 Kingboard: Tg130/150 Goldenmax: Tg130	Kingboard-Tg150.pdf Goldenmax-Tg130.pdf Kingboard-Tg130.pdf Shengyi-Tg140.pdf Shengyi-Tg150.pdf Shengyi-Tg170.pdf
	High Frequency Board	Rogers	-
	CEM-1	Kingboard: Tg130	Kingboard-Tg130
	Aluminum	Goldenmax: Tg130	Goldenmax-Tg130
	Thermoelectric Separation Copper Substrate	Jinpin Technology Copper Plate	-
Dimensions	Maximum size	Standard: a:630×b:520mm
Dimensions	Minimum size	1. The minimum production size of a single PCB is 10×5mm 2. The minimum production size of an panel PCB is 50×50mm 3. A single PCB size below ≤ 20×20mm is an ultra-small board
Board thickness range	2 layers: 0.4-4.0mm 4 layers: 0.4-4.0mm 6 layers: 0.6-4.0mm 8 layers: 1.0-4.0mm 10 layers: 1.0-4.0mm
Board thickness tolerance	T≥1.0mm：±10% T<1.0mm：±0.1mm		-
Inner layer/outer layer copper thickness	Inner layer: 1oz, 2oz, 3oz, 4oz, 5oz, 6oz Outer layer: 1oz, 2oz, 3oz, 4oz, 5oz, 6oz	Also known as copper weight 35μm=1oz, 70μm=2oz, 105μm=3oz	-
Imaging production	Negative film, pattern electroplating (traditional tin plating positive film process)		-
Surface treatment	Bare Copper, OSP, HASL With Lead, HASL Lead-free, Immersion Gold, Immersion Tin, Immersion Silver, Nickel Palladium Gold, OSP+ Selective Immersion Gold, Lead-free HASL + Selective Immersion Gold, Lead-free HASL + Selective Gold Plating		-
Plugged vias	Use soldermask ink	① Only the vias covered with soldermask ink on double sided can be made ② Vias edge to opening pad edge≤0.2 are difficult to make plugged vias ③ Vias diameter≤0.5mm
Metal edging process	Metal edging copper thickness ≥ 15um
Gold finger beveling	PCB thickness: 0.8-2.4mm PCB size: Min 5080mm Max: 500200mm Angle: 10-70° Angle tolerance: ±5° Depth tolerance: ±0.15mm
Electrical test	Flying probe test: unlimited Test rack≤3500 points		-
Edge rail	≥4mm
FQC	Warpage degree: 0.75%		-

Category	Capability	Details	Graphical description
Drilling	Drill Hole Size	0.15~6.5mm
	Rate of finished board thickness to min plated hole diameter	10:1
	Countersink hole	1. Hole size specification: <6.5mm 2. Angle: 90° 140° 180° 3. Hole size tolerance: ±0.1mm 4. Depth Tolerance: ±0.15mm
	Drill Hole Size Tolerance	1. Diameter of plug-in hole: +/-0.075mm 2. Diameter of crimping hole: +/-0.05mm (leave note when order)	-
	Minimum Via/Pad	Double-side board: 0.2mm (inner diameter)/0.5mm (outer diameter) Multi-layer board: 0.15mm (inner diameter)/0.25mm (outer diameter) ①The outer diameter must be 0.1mm larger than the inner diameter, 0.15mm preferred ②Preferred Min. Via hole size: 0.2mm
	Min. Plated Slot	Width≥0.7mm
	Min. Non-Plated Slots	Width≥0.8mm
	Rectangle Hole/Slot	Don’t support
	Plated Hole Copper Thickness	18-100um	-
	Plated Half Hole	When it comes to plated half hole, it also called castellated holes, which is plated with copper based on the specialized process on the edge of PCB. And plated half-holes are predominantly used for board-on-board connections, mostly where two boards with different technologies are combined. E.g. the combination of complex microcontroler modules with common, individually designed PCBs ① Diameter: ≧0.4mm ② Spacing: ≥0.35mm ③ Pad edge to board edge: ≧1MM ④ Min. board size: 10*10mm

Category	Capability	Details	Graphical description
Trace	Min. trace width/spacing (1OZ)	0.076/0.076mm(3mil/3mil)
	Min. trace width/spacing (2OZ)	0.14/0.14mm (5.5mil/5.5mil)
	Min. trace width/spacing (3OZ)	0.2/0.2mm (8mil/8mil)
	Min. trace width/spacing (4OZ)	0.25/0.25mm (10mil/10mil)
	Min. trace width/spacing (5OZ)	0.35/0.35mm (14mil/14mil)
	Min. trace width/spacing (6OZ)	0.45/0.45mm (18mil/18mil)
	Trace Width Tolerance	±20%	-
	Pad Edge to trace Edge Spacing	≧0.1mm (greater if possible), BGA pad to trace minimum spacing 0.075mm
	Width of solder ring for plated DIP holes(1OZ)	≧0.2mm (recommended value), the limit value is 0.18mm	-
	Width of solder ring for non-plated DIP holes	≧0.4mm (recommended value), because the dry film is used to seal the hole, and the 0.15MM pad or copper surface will be hollowed out around the copper-free hole . Please try to increase the pad for soldering If the pad is too small, it may be a coil or no pad
	BGA	① BGA pad diameter: ≧0.2mm ② BGA pad edge to trace edge: ≧0.075mm

Category	Capability	Details
Silkscreen	Text height	h≧0.75mm, character width 0.1mm (special font, Chinese, hollow character height h＞38mil (0.97mm))
	Text width	≧0.1mm (lower than this value may not be printed)
	Spacing from character to exposed copper pads	≧0.15mm (lower than this value will hollow out the characters to avoid contacting the pad)

Category	Capability	Details	Graphical description
Solder Mask	Solder Mask Color	Green, Cold White, Blue, Black, Yellow, Red, Purple, Matte Black, Matte Green	-
	Solder Mask Thickness	≧10um
	Minimum Solder Bridge Width	1. Green: 0.075mm 2. Other colors: 0.125mm (red, yellow, blue, white, matte green, black, matte black, purple)

Category	Capability	Details	Graphical description
Panelization	Profiling	edge forming	1. Forming edge to forming edge A: ±0.15mm;
		V-cut	Angle: 25°, 30° According to different plate thickness: Remaining thickness: 0.25-0.8mm Remaining thickness tolerance: ±0.1mm
		Maximum size of V-CUT	1000*1500mm
	Panel by V-cut	① The distance between the V-cut line and the copper ≧0.4mm ②The default is to use 0-gap paneling (only two sides of the V-cutting are required, and the other two sides can use a panel gap of 1.6mm or 2mm)
	Panel by stamp holes	① The distance between the copper and the edge of the board at the non-stamp hole is ≧0.3mm ② Tolerance of the gong edge at the non-stamp hole: ±0.2mm (common gong), ±0.1mm (premium gong) ③ The default board gap is 1.6mm or 2mm ④There will be a gear shape at stamp hole position after the panel is separated. ⑤ Minimum width of edges rails is 4MM (our SMT requires 5mm width, 1mm for fiducial mark, 2mm for tooling hole, 3.85mm from fiducial mark to board edge).

Rigid PCB Capability