Technical index |
Mass Batch |
Small batch |
Sample |
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---|---|---|---|---|---|---|
Base Material |
FR4 |
Normal Tg |
Shengyi S1141、KB6160、Huazhen H140(not suitable for lead free process ) |
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Middle Tg |
For HDI、multi layers: SY S1000H、ITEQIT158、HuazhengH150; TU-662; |
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High Tg |
For thick copper、high layer:SY S1000-2; ITEQIT180A; HuazhengH170;ISOLA:FR408R; 370HR; TU-752; |
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Halogen Free |
Middle Tg :SY S1150G、HuazhengH150HF、H160HF;high Tg: SY S1165 |
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High CTI |
CTI≥600 SY S1600、Huazheng H1600HF、H1600A; |
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High Frequency |
Rogers、 Arlon、Taconic、SY SCGA-500、S7136; HuazhengH5000 |
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High Speed |
SY S7439;TU-862HF、TU-872SLK;ISOLA:I-Speed、I-Tera@MT40;Huazheng:H175、H180、H380 |
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Flex Material |
Base |
Glue-free:Dupont AK XingyangW-type, Panosonic RF-775; |
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Coverlay |
SY SF305C、Xingyang Q-type |
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Special PP |
No flow PP: VT-447LF,Taiguang 370BL Arlon 49N |
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Metal Base |
Berguist Al-base 、Huazheng Al-base、chaosun Al-base、copperbase |
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Special |
High heat resistance rigidity PI: Tenghui VT-901、Arlon 85N,SY S260(Tg250) |
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Layers |
FR4 |
24 |
36 |
64 |
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Rigid&Flex /(Flex) |
16(12) |
20(12) |
24(16) |
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High Frequency Mixed Lamination |
12 |
18 |
24 |
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100% PTFE |
4 |
12 |
18 |
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HDI |
2 steps |
3 steps |
4 steps |
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Delivery Size |
Max(mm) |
460*560 |
460*560 |
550*900 |
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Min(mm) |
20*20 |
10*10 |
5*10 |
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Width / Gap |
Inner(mil) |
0.5OZ base copper: 3/3 1.0OZ base copper: 4/4 2.0OZ base copper: 5/6 |
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Outer(mil) |
1/3OZ base copper: 3/3 0.5OZ base copper: 4/4 1.0OZ base copper: 5/5 |
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Line Width Tolerance |
>5.0 mil |
±20% |
±20% |
±1.0mil |
||
≤5.0 mil |
±1.0mil |
±1.0mil |
±1.0mil |
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Copper Thickness |
Inner layer(OZ) |
4 |
6 |
12 |
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Out layer(OZ) |
4 |
6 |
15 |
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Board thickness(mm) |
0.5-5.0 |
0.4-6.5 |
0.4-11.5 |
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Final Board Thickness |
>1.0 mm |
±10% |
±8% |
±8% |
||
≤1.0 mm |
±0.1mm |
±0.1mm |
±0.1mm |
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Board thickness/drill bit |
10:1 |
12:1 |
13:1 |
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Contour |
Bevel edge |
20~60 degree;±5degree |
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Bow and twist |
≤0.75% |
≤0.75% |
≤0.5% |
Technical index |
Mass Batch |
Small batch |
Sample |
|||
---|---|---|---|---|---|---|
Drilling |
Min laser (mm) |
0.1 |
0.1 |
0.1 |
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Min CNC(mm) |
0.2 |
0.15 |
0.15 |
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Max CNC drill bit(mm) |
6.5 |
6.5 |
6.5 |
|||
Min Half Hole(mm) |
0.5 |
0.4 |
0.4 |
|||
PTH Hole (mm) |
Normal |
±0.1 |
±0.075 |
±0.075 |
||
Pressing Hole |
±0.05 |
±0.05 |
±0.05 |
|||
Hole Angle (conical) |
Width of upper diameter≤6.5mm:800、900、1000、1100;Width of upper diameter≥6.5mm:900; |
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Precision of Depth-control Drilling(mm) |
±0.10 |
±0.075 |
±0.05 |
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Number of blind CNC holes of one side |
≤2 |
≤3 |
≤4 |
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Minimum via hole spacing (different network, military, medical, automobile )mm |
0.50 |
0.45 |
0.40 |
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Minimum via hole spacing (different network, general industrial control and consumer electronic ) mm |
0.4 |
0.35 |
0.3 |
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The minimum hole wall spacing of the over hole (the same network mm) |
0.20 |
0.2 |
0.15 |
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Minimum hole wall spacing (mm) for device holes |
0.80 |
0.70 |
0.70 |
|||
The minimum distance from via hole to the inner copper or line |
0.2 |
0.18 |
≤10L: 0.15 |
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The min distance from Device hole to inner copper or line |
0.3 |
0.27 |
0.25 |
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Welding Ring |
Via hole |
4(HDI 3mil) |
3.5(HDI 3mil) |
3 |
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Component hole |
8 |
6 |
6 |
|||
Final Board Thickness |
>1.0 mm |
±10% |
±8% |
±8% |
||
≤1.0 mm |
±0.1mm |
±0.1mm |
±0.1mm |
|||
CNC |
contour tolerance(mm) |
±0.15 |
±0.10 |
±0.10 |
||
V-CUT Tolerance of residual thickness(mm) |
±0.15 |
±0.10 |
±0.10 |
|||
Routing slot(mm) |
±0.15 |
±0.10 |
±0.10 |
|||
Precision of controlled deep milling(mm) |
±0.15 |
±0.10 |
±0.10 |
Technical index |
Mass Batch |
Small batch |
Sample |
|||
---|---|---|---|---|---|---|
Solder Dam (mil) |
(solder mask) |
5 |
4 |
4 |
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(hybrid) |
6 |
5 |
5 |
Technical index |
Mass Batch |
Small batch |
Sample |
|||
---|---|---|---|---|---|---|
Surface Treatments |
Immersion gold |
Ni thickness |
118-236 |
118-236 |
118-236 |
|
Max gold (uinch) |
3 |
3 |
6 |
|||
Hard gold(Au thick) |
Gold finger |
15 |
30 |
60 |
||
NiPdAu |
NI |
118-236 |
||||
PA |
2-5 |
|||||
Au |
1-5 |
|||||
Graph electric gold |
NI |
120-400 |
||||
AU |
1-3 |
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Immersion tin |
Tin |
0.8-1.2 |
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Immersion Ag |
Ag |
6-10 |
||||
OSP |
thick |
0.2-0.5 |
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HAL/HAL LF |
BGApad(mm) |
≥0.3×0.3 |
||||
thickness |
0.6≤H≤3.0 |
|||||
Board thickness vs hole diameter |
Press hole≤3:1 |
|||||
Tin(um) |
2.0-40.0 |
Technical index |
Mass Batch |
Small batch |
Sample |
|||
---|---|---|---|---|---|---|
Rigid & Flex |
Maximum dielectric thickness of flex |
Glue –free 25um |
Glue-free 75um |
Glue-free75um |
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Flex part width(mm) |
≥10 |
≥5 |
≥2 |
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Max delivery size (mm) |
200×400 |
200×500 |
400 ×550 |
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distance of via hole to edge of Rigid&flex(mm) |
≥1.2 |
≥1.0 |
≥0.8 |
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(mm)distance of components hole to the edge of R&F |
≥1.5 |
≥1.2 |
≥1.0 |
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Rigid & Flex |
Structure |
The outer layer structure of the flex part, the PI reinforcement structure and the separation structure |
Aluminum based rigid flex , rigid flex HDI, combination, electromagnetic shielding film |
Technical index |
Mass Batch |
Small batch |
Sample |
|||
---|---|---|---|---|---|---|
Special Tech |
Back drilling PCB, metal sandwich, thick copper buried blind hole, step slot, disc hole, half hole, mixed lamination |
Buried magnetic core PCB |
Buried capacitor / resistor, embedded copper in partial area, 100% ceramic PCB, buried riveting nut PCB, embedded components PCB |