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Panel For Example Panel For Example Panel For Example
Item category Small and Medium Batches Order (Order area ≥10㎡) Prototype Order (Order area < 3㎡)
Product structure 1+n+1; 1+1+n+1+1; 2+n+2 1+n+1, 1+1+n+1+1, 2+n+2
F+R, cu+F+cu, R+F+R+F+R, R+F+R F+R, cu+F+cu, R+F+R+F+R, R+F+R
Number of layers Rigid-flex PCB ≤18L ≤24L
FPC ≤10L ≤16L
Board thickness (mm) Rigid-flex board 0.3-3.2 0.3-3.2
FPC 0.06-0.35 0.06-0.35
Board size (mm) Rigid-flex PCB 15*15 to 310*510 15*15 to 310*510
FPC 5*15 to 310*510 5*15 to 310*510
Copper thickness (OZ) Maximum copper thickness of FR-4 Outer layer 2OZ, inner layer 2OZ Outer layer 2OZ, inner layer 2OZ
Maximum copper thickness of FPC Outer layer 1 OZ, inner layer 1 OZ Outer layer 2 OZ, inner layer 2 OZ
Minimum copper trace width and spacing capability (um) 75/75 75/75
Minimum diameter of mechanical drill (mm) 0.2 0.15
Rigid part material Tg170 S1000-2M,IT180A S1000-2M,IT180A
High TG halogen-free S1165 S1165
Thickness of dielectric layer (mm) 0.1-3.2 0.075-3.2
Flex part material Flexible material PI DuPont, Panasonic, Shengyi PI DuPont, Panasonic, Shengyi
Surface insulation layer Cover film, soldermask Cover film, soldermask
Thickness of dielectric layer (mm) 0.025-0.1 0.012-0.1
Surface treatment Rigid-flex board HASL with lead / lead-free, immersion gold, immersion tin, immersion silver, OSP, HASL + gold finger, immersion gold + gold finger, nickel palladium gold, OSP + gold finger , immersion gold + OSP HASL with lead / lead-free, immersion gold, immersion tin, immersion silver, OSP, HASL + gold finger, immersion gold + gold finger, nickel palladium gold, OSP + gold finger, immersion gold + OSP
FPC FPC HASL with lead / lead-free, immersion gold, OSP