Rigid-Flex PCB Capability

Specifications

Category		Small and Medium Batches Order (Order area ≥10㎡)	Prototype Order (Order area < 3㎡)
Poduct structure		1+n+1; 1+1+n+1+1; 2+n+2	1+n+1, 1+1+n+1+1, 2+n+2
Poduct structure		F+R, cu+F+cu, R+F+R+F+R, R+F+R	F+R, cu+F+cu, R+F+R+F+R, R+F+R
Number of layers	Rigid-flex PCB	≤18L	≤24L
Number of layers	FPC	≤10L	≤16L
Board thickness (mm)	Rigid-flex board	0.3-3.2	0.3-3.2
Board thickness (mm)	FPC	0.06-0.35	0.06-0.35
Board size (mm)	Rigid-flex PCB	1515 to 310510	1515 to 310510
Board size (mm)	FPC	515 to 310510	515 to 310510
Copper thickness (OZ)	Maximum copper thickness of FR-4	Outer layer 2OZ, inner layer 2OZ	Outer layer 2OZ, inner layer 2OZ
Copper thickness (OZ)	Maximum copper thickness of FPC	Outer layer 1 OZ, inner layer 1 OZ	Outer layer 2 OZ, inner layer 2 OZ
Minimum copper trace width and spacing capability (um)		75/75	75/75
Minimum diameter of mechanical drill (mm)		0.2	0.15
Rigid part material	Tg170	S1000-2M,IT180A	S1000-2M,IT180A
	High TG halogen-free	S1165	S1165
	Thickness of dielectric layer (mm)	0.1-3.2	0.075-3.2
Flex part material	Flexible material	PI DuPont, Panasonic, Shengyi	PI DuPont, Panasonic, Shengyi
	Surface insulation layer	Cover film, soldermask	Cover film, soldermask
	Thickness of dielectric layer (mm)	0.025-0.1	0.012-0.1
Surface treatment	Rigid-flex board	HASL with lead / lead-free, immersion gold, immersion tin, immersion silver, OSP, HASL + gold finger, immersion gold + gold finger, nickel palladium gold, OSP + gold finger , immersion gold + OSP	HASL with lead / lead-free, immersion gold, immersion tin, immersion silver, OSP, HASL + gold finger, immersion gold + gold finger, nickel palladium gold, OSP + gold finger, immersion gold + OSP
Surface treatment	FPC	FPC	HASL with lead / lead-free, immersion gold, OSP

Stack Up

4 conductive layers RFPC

1.0mm
1.6mm

	Rigid part		Flex part
	top soldermask layer	20um
rigid-top copper layer	Copper	18um(Finished Copper thickness 35um)
	FR4	400um	PI	12.5um
	Pure gum	13um	Adhesive	15um
flex-copper 2 layer	Copper	18um	Copper	18um
	Adhesive	20um	Adhesive	20um
	PI	25um	PI	25um
	Adhesive	20um	Adhesive	20um
flex-copper 3 layer	Copper	18um	Copper	18um
	Pure gum	13um	Adhesive	15um
	FR4	400um	PI	12.5um
rigid-bottom copper layer	Copper	18um(Finished Copper thickness 35um)
	bottom soldermask layer	20um
	Total thickness	1003um	FPC thickness	156um

	Rigid part		Flex part
	top soldermask layer	20um
rigid-top copper layer	Copper	18um(Finished Copper thickness 35um)
	FR4	700um	PI	12.5um
	Pure gum	13um	Adhesive	15um
flex-copper 2 layer	Copper	18um	Copper	18um
	Adhesive	13um	Adhesive	13um
	PI	25um	PI	25um
	Adhesive	13um	Adhesive	13um
flex-copper 3 layer	Copper	18um	Copper	18um
	Pure gum	13um	Adhesive	15um
	FR4	700um	PI	12.5um
rigid-bottom copper layer	Copper	18um(Finished Copper thickness 35um)
	bottom soldermask layer	20um
	Total thickness	1589um	FPC thickness	142um