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Panel For Example Panel For Example Panel For Example

Specifications

CategorySmall and Medium Batches Order (Order area ≥10㎡)Prototype Order (Order area < 3㎡)
Poduct structure1+n+1; 1+1+n+1+1; 2+n+21+n+1, 1+1+n+1+1, 2+n+2
F+R, cu+F+cu, R+F+R+F+R, R+F+RF+R, cu+F+cu, R+F+R+F+R, R+F+R
Number of layersRigid-flex PCB≤18L≤24L
FPC≤10L≤16L
Board thickness (mm)Rigid-flex board0.3-3.20.3-3.2
FPC0.06-0.350.06-0.35
Board size (mm)Rigid-flex PCB15*15 to 310*51015*15 to 310*510
FPC5*15 to 310*5105*15 to 310*510
Copper thickness (OZ)Maximum copper thickness of FR-4Outer layer 2OZ, inner layer 2OZOuter layer 2OZ, inner layer 2OZ
Maximum copper thickness of FPCOuter layer 1 OZ, inner layer 1 OZOuter layer 2 OZ, inner layer 2 OZ
Minimum copper trace width and spacing capability (um)75/7575/75
Minimum diameter of mechanical drill (mm)0.20.15
Rigid part materialTg170S1000-2M,IT180AS1000-2M,IT180A
High TG halogen-freeS1165S1165
Thickness of dielectric layer (mm)0.1-3.20.075-3.2
Flex part materialFlexible materialPI DuPont, Panasonic, ShengyiPI DuPont, Panasonic, Shengyi
Surface insulation layerCover film, soldermaskCover film, soldermask
Thickness of dielectric layer (mm)0.025-0.10.012-0.1
Surface treatment Rigid-flex board HASL with lead / lead-free, immersion gold, immersion tin, immersion silver, OSP, HASL + gold finger, immersion gold + gold finger, nickel palladium gold, OSP + gold finger , immersion gold + OSP HASL with lead / lead-free, immersion gold, immersion tin, immersion silver, OSP, HASL + gold finger, immersion gold + gold finger, nickel palladium gold, OSP + gold finger, immersion gold + OSP
FPCFPCHASL with lead / lead-free, immersion gold, OSP