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Panel For Example Panel For Example Panel For Example
Flexible PCB Capability
项目 Items 类别 Categories 常规能力 Capability
通用能力
General Capability
板尺寸
Board Size
Min(pcs) 1*0.5mm
Max (Pnl Size) 250*1200mm
基材厚度
Base Material Thickness
N/A 0.06——0.3mm
成品厚度
Board Thickness
N/A 0.1-0.5mm
基铜厚度
Base Copper Thickness
N/A 1/3OZ——2OZ
PTH孔孔壁铜厚
PTH Hole Wall Copper Thickness
N/A 8-20μm
盲孔填孔能力纵横比(孔径:孔深)
Blind Hole Filling Capacity Aspect Ratio (Hole Size: Hole Depth)
N/A 1:10
盲孔填孔能力(孔径大小)
Blind Hole Filling Capacity (Hole Size)
N/A 50-150μm
单线阻抗公差
Single Line Impedance Tolerance
N/A ±10%
差动阻抗公差
Differential Impedance Tolerance
N/A ±10%
最小线宽线距(双面板)
Min Track/Spacing (Double Layers Board)
面铜厚度:8-14μm Surface Copper Thickness 40/40 um
面铜厚度:15-20μm 45/45 um
面铜厚度:21-30μm 55/55 um
面铜厚度:31-40μm 75/75 um
面铜厚度:≥40μm 80/80 um
线宽公差
Line Width Tolerance
线宽≤0.050mm Line Width ±.02mm
0.05mm<线宽≤0.15mm ±20%
线宽>0.150mm ±10%
丝印
Silkscreen
丝印字符最小宽度/间距
Silkscreen Character Min Width/Spacing
N/A 4mil
阻焊
Impedance
绿油厚度范围
Green Solder Mask Thickness Range
线面油厚 Line Surface Solder Mask Thickness 10~30 μm
相关
Related Capacity
白油线边至板边尺寸公差
Dimension Tolerance from Line Edge to Plate Edge
N/A ±0.25 mm
白油线宽度公差
Width Tolerance of White Line
平滑处 Smooth Place ±0.10 mm
凹凸处 Bump Place ±0.20 mm
孔径相关
Hole Size Related
最小钻孔孔径
Min Drilling Hole Size
机械钻孔 Machine Drilling 0.100 mm
最小冲孔孔径
Min Punching Hole Size
N/A 0.50 mm
完成孔孔径公差
Complete Hole Size Tolerances
镀通孔 PTH ±0.050 mm
非镀通孔 NPTH ±0.025 mm
表面处理
Surface Finishing
镀镍金
Nickel Gold Plating
镍厚 Nickel Thickness 40~ 314U"
镍层厚度公差 Nickel Thickness Tolerance ±78U"
金厚 Gold Thickness 1.18U" ~ 40U"
最小间距(金手指或Pad) Min Spacing (Golden Finger or Pad) 35um
沉镍金
Nickel Gold Immersion
镍厚 Nickel Thickness 40 ~ 236 U"
镍层厚度公差 Nickel Thickness Tolerance ±40U"
金厚 Gold Thickness 1U" ~ 3 U"
最小间距(金手指或Pad)Min Spacing (Golden Finger or Pad) 40um
OSP OSP层厚 OSP Thickness 6U"~20U"