Board Thickness: 0.8mm-2.0mm
Copper Thickness: 0.5/0.75/1.0/2.0oz
Thermal Conductivity: 1.0W/1.5W/2.0W
Material: Goldenmax/Guangzhou Aluminum
Equipment: Automatic Equipment
Test: 100% AOI Test
Prototype ≤ 30 pcs: 72 hours
Small Batch 1-5m ²: 4 days
Large Batch 5-30m ²: 6 days
High Quality Aluminum PCB Manufacturing Service
ALLPCB Lighting Covers Outdoor Lighting, Indoor Lighting, Automotive Lighting, Commercial Lighting…etc.
应用范围：全系列日光灯
Size：1500mm
Material：Aluminum/FR4
Board Thickness：0.6 - 2.0mm
Copper Thickness：18-70um
Surface Treatment：OSP/HAL/HASL (Lead free)
Thermal Conductivity：1.0-3.0W
Breakdown Voltage：1.0-3.0KV(AC)
Combustibility：94V-0
Standard：UL & ROHS
应用范围：全系列日光灯
Size：1500mm
Material：Aluminum/FR4
Board Thickness：0.6 - 2.0mm
Copper Thickness：18-70um
Surface Treatment：OSP/HAL/HASL (Lead free)
应用范围：全系列日光灯
Size：1500mm
Material：Aluminum/FR4
Board Thickness：0.6 - 2.0mm
Copper Thickness：18-70um
Surface Treatment：OSP/HAL/HASL (Lead free)
Order Area & Lead Time
·< 1㎡ : 3 Days ·1-5㎡ : 3 DaysCrazy Price
·$8 for 5pcs, 100x100mmSuperior Quality
·Material: Guangzhou Aluminum,Laser cutting, 48 hours ultrafast prototype, No expedited fee.
The products covering: outdoor lighting, home lighting, automotive lighting, electronic machinery, commercial lighting, indoor lighting and etc.
Aluminum PCB ≤10*10cm, 5pcs
Aluminum PCB ≤10*10cm, 10pcs
Batch Orders, Thickness 1.6, >20㎡
Aluminum Printed Circuit Board Fabrication
All of our products are made in accordance with strict technical standard.
Quality matters! Every piece counts!
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Aluminum PCB Fabrication
ALLPCB high-quality materials to meet user
needs. Our products made in accordance with
strict technical standard to ensure the quality of all
materials. Every piece counts.
| Test Item | Unit | Processing Conditions (A) | Typical Value | ||
| MAF-01 | MAF-02 | MAF-03 | |||
| Peel Strength | N/mm | After Thermal Stress (288℃,2min) | 1.1 | 1.05 | 1.05 |
| Blister Test | S | ≥120 | 120 | 120 | 120 |
| Surface Resistivity | MΩ | MΩ C-96/35/90 |
106 106 |
106 106 |
106 106 |
| Volume Resistivity | MΩ.m | Settlement State C-96/35/90 |
106 106 |
106 106 |
106 106 |
| Thermal Resistance | ℃/W | Settlement State | =1.0 | =0.8 | =0.8 |
| 1MHZ Dielectric Constant | - | Settlement State | 3.8 | 3.9 | 2.7 |
| 1MHz Dielectric Loss Factor | - | Settlement State | V | 0.026 | 0.009 |
| Thermal Stress (A) | min | 280℃ | No Delamination, No Blistering | ||
| Thermal Conductivity | W/m.k | Settlement State | 1.0-1.2 1.5-1.8 2.0-3.0 | ||
| Dielectric Breakdown | KV | D-48/50+D/0.5/23 | 2.0- 2.5kv 4kv 5kv | ||
| Flammability | - | Settlement State | FV-0 | ||
| CTI | V | Settlement State | 250-600 | ||
Heat Dissipation
Dimensional Stability
Machinability
Electromagnetic Shielding
| Class | Types | Features |
|---|---|---|
| Aluminum Base Copper Clad Laminate GM-AL Series | MLT-002 | Aluminum Base / Copper Foil / FR4 Fiberglass (Tg 130-170) |
| MLT-003 | Aluminum Base / Copper Foil / No Fiberglass (Laird) / Thermal Conductivity 3.0w / n..k | |
| MLT-004 | Aluminum Base / Copper Foil / No Fiberglass (Bergquist) / Thermal Conductivity 2.0w / n..k | |
| MLT-005 | Aluminum Base / Copper Foil / No Fiberglass / Heat Resistance 350℃10min | Dielectric Constant 4.2 | |
| MLT-006 | Aluminum Base / Copper Foil / No Fiberglass (Bergquist) / Thermal Conductivity 2.0w / n..k | |
| Special Copper Clad Laminate GM-AL Series | MLT-007 | Heavy Copper Clad Laminate (4oz-10oz), High Current, High Power Circuit |
Outdoor Lighting
Home Lighting
Automotive Lighting
Electronic Machinery
Commercial Lighting
Indoor Lighting
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