Specifications
Category | Capability | Details |
Layers | 1-14 layers | 1-14 layers PCB prototypes & batch orders |
PCB Material | CEM-1/ FR-4/ Aluminum | White Ink: Taiyo 2000 Serie |
Green Ink: Taiyo 07 Serie | ||
PCB Material | CEM-1/ FR-4/ Aluminum | CEM-1(Kingboard KB5150) |
FR-4(Shengyi S1141, Shengyi S1000H, Shengyi S1000-2M, Kingboard KB6160) | ||
Aluminum (Goldenmax GL11, Guangzhou Aluminum) | ||
TG Value | Shengyi TG 170 | Shengyi TG 170 |
Kingboard TG 170 | Kingboard TG 170 | |
Heat Conductivity for Alu. boards | 1.0 | / |
CTI | Class 3(CTI≥175V) | / |
Dimension | Min 80*80mm | |
Max 506*580mm | ||
Dimension Tolerance (Outline) | ±0.15mm | ±0.15mm for CNC routing |
±0.15mm for V-scoring | ||
Thickness | 0.4--3.2mm | |
Thickness Tolerance ( t≥1.0mm) | ± 10% | Normally take positive tolerance due to PCB processing steps such as electroless copper, solder mask and other types of finish on the surface. |
Thickness Tolerance | ±0.1mm | Normally take positive tolerance due to PCB processing steps such as electroless copper, solder mask and other types of finish on the surface. |
(t<1.0mm) | ||
Min Trace | 4mil(0.1mm) | Minimum trace width is 4mil, strongly suggest to design trace above 6mil (0.15mm) to save cost. |
Min Spacing | 4mil(0.1mm) | Minimum trace spacing is 4mil, strongly suggest to design trace above 6mil (0.15mm) to save cost. |
Copper Thickness (Inner Copper) | 18~70um(i.e.0.5Oz~2Oz) | 1 oz=35um |
Copper Thickness (Outer Copper) | 35~70um(i.e.1Oz~2Oz) | 1 oz=35um |
Bow and Twist | Per cater-corner length,≤0.75% | For boards without SMT, the max 1.5% |
PTH Deviation | ±3mil | / |
NPTH Deviation | ±2mil | / |
Distance between Trace and Outline | ≥0.3mm(12mil) | Ship as individual boards: Distance between Trace and Outline ≥0.3mm |
Ship as Panelized boards with V-cut: Distance between Trace and V-cut line ≥0.4mm |
Drilling & Hole
Category | Capability | Details |
Drilling Size | 0.2--6.5mm | For vias larger than 6.5mm, multiple drilling or milling is recommended |
PTH Deviation | ±3mil | |
NPTH Deviation | ±2mil | |
Hole Position Deviation | ±3mil | |
Hole Wall Roughness(Max) | 1.5mil | |
Min Slot Width | 0.6mm | For HASL, the min. finished slot width is 0.45mm,for other surface finish, it is 0.5mm. |
Board Thickness/Via Diameter | ≤6:1 | 7:1≤value≤8:1, add one more day for fabrication |
PTH Deviation (Width) | ±4mil | |
PTH Deviation (Length) | ±5mil | |
NPTH Deviation (Width) | ±3mil | |
NPTH Deviation (Length) | ±4mil | |
Hole Wall Copper Thickness (Thinnest) | ≥0.71mil | |
Hole Wall Copper Thickness (Average) | ≥0.8mil | |
Via Space (Same Net) | ≥8mil | |
Via Space (Different Net) | ≥17mil | |
Min Space for Component Vias in Different Net | ≥24mil | |
Max. PTH (Round Hole) | 8mm | |
Max. PTH (Round Slot Holes) | 6*10mm | |
Annular Ring | ≥0.153mm(6mil) | It doesn’t limit the size of the single side of the annular ring if there is enough space. Or annular ring surrounded by traces should be equal to or larger than 6mil. |
Finished Hole Diameter (CNC) | 0.2--6.5mm | Due to the copper attached to the inner wall of the hole, the diameter of the finished hole is generally smaller than designed. |
Hole Size Tolerance (CNC) | ±0.075mm | E.g. For the 0.6mm hole, the finished hole size between 0.525mm to 0.675mm is acceptable. |
Solder Mask
Category | Capability | Details |
Solder Mask: (TAIYO) | Green ,Red, Blue, White ,Black | No extra charge (Green, White) |
Silkscreen Color: (TAIYO) | Green ,Red, Blue, White ,Black | No extra charge (Green, Black, White) |
Solder Mask | Photosensitive ink | Photosensitive ink is mostly adopted. Plastisol is used in the inexpensive paper-based boards. |
Solder Mask | Photosensitive ink | Photosensitive ink is mostly adopted. Plastisol is used in the inexpensive paper-based boards. |
Min Character Width (Legend) | ≥0.15mm | Characters width less than 0.15mm will be unidentifiable. |
Min Character Height (Legend) | ≥0.8mm | Characters height less than 0.8mm will be unidentifiable. |
Character Width to Height Ratio (Legend) | 01:05:00 | 1:5 is the most suitable ratio for production. |
Surface Treatment
Category | Capability | Details |
Surface Finish | HASL, Immersion gold / sliver / tin, OSP, Hard Gold plating, Soft gold plating, NiPdAu | HASL is not acceptable for 0.4mm board. |
Special Technique
Category | Capability | Details |
Half Hole Diameter | Minimum Half hole Diameter: 1mm, No more than 10 holes. | Half hole is a special technology, so half hole diameter should be greater than 1mm. |
Solder Mask Bridge | 0.1mm | Please make a note, if there is solder mask bridge requirement. The price may rise. |
Panelization without Spacing | 0mm | Ship as Panelized boards and the spacing between boards is 0mm. |
Panelization with Spacing | 1.6mm | Make sure the spacing between boards should be ≥1.6mm, otherwise it will be hard to process routing. |
Other | V cut, Metal edging, Resin plug hole, Gold finger bevel | |
Certificate | ISO9001、ISO14001、UL、QC080000、IATF16949 CQC、ISO 13485(As Required) |
Advanced Equipment List
Equipment | Brand | Quantity |
2 Open Hot Press | Erwei | 2 |
6 Open Subpress | Erwei | 2 |
Bench Copper Thickness Gauge for Surface and Hole | Lingshengchuang | 1 |
Coordinate Measuring Machine | Lingshengchuang | 1 |
Quadratic Measuring Machine | Lingshengchuang | 1 |
Metallurgical Microscope | Lingshengchuang | 2 |
Tensile Tester | Lingshengchuang | 1 |
Ion Contamination Tester | Lingshengchuang | 1 |
X-ray Fluorescence Spectrograph(ROHS/Halogen) | Lingshengchuang | 1 |
Constant temperature and humidity Controller | Lingshengchuang | 1 |
Impedance Tester | Lingshengchuang | 1 |
Automatic Image Counterpoint LED Exposure Machine | DPOPT | 1 |
Appearance Inspection Machine | Szkaima | 1 |
Laser Marking Machine | 2 | |
LDI Resistance Welding Direct Imaging Equipment | CFMEE | 1 |