I am looking for some general information with respect to BGA devices on circuit boards. I work for an automation company and am curious to know who's doing what with BGA placements, specifically the heat - sink application to the BGA device. Generally, are heat sinks added to the bga prior to or after assembly on to the board? How many bga devices are there typically on a board? What through-put (production) rate is typically required; i.e. boards produced per hour? I realize my questions are very general and are not specific. However, I would greatly appreciate any information possible. If you have any specific applications you'd like to discuss concerning pick and place equipment for bga devices and / or heat sink placement, please feel free to contact me.
Charlie Laub
2017/4/21 16:25:10
You are a genuis!
Vasiliy
2017/2/28 14:51:28
Quite useful and impressive info.Thanks for marvelous posting.
Quincy
2017/2/28 14:51:28
Really helpful.
Barlow
2017/2/28 14:51:28
Keep your sharing like this. You have made a nice post and I really learned a lot from you. It will help me work out my new project.
John Farrugia
2017/2/28 14:51:28
Great help to my new project.