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A question for you all!
Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't.
My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clean under 20 mil pitch QFP's because the water molecules (that was the reason often given) couldn't evacuate particulate material left under components. What's changed - especially concerning CSP's as uBGA's etc. with clearances under 10 mils under them.
CurveAudioDesign
2017/3/1 5:53:29
Impressive
Chisel
2017/3/1 5:53:29
It was truly informative. Your post is very useful.Many thanks for sharing!
andrea
2017/3/1 5:53:29
Remarkable.It help me a lot. Thank you.
Bernie
2017/3/1 5:53:29
Nice content you’ve posted in here
Rafael Mendoza
2017/3/1 5:53:29
I am happy that you shared this helpful information with us.Please keep us up to date like this.