I have datas to substain that a not wetting PCB ( the HAL oxided or not uniform in thickness )if soldered in reflow, it shows voids with X-Ray inspection.The voids are in side all the joints not only on the solder pads levell.
Is there a technical demostration or correlation between a not wetting PCB and the voids formation?
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2017/2/3 13:24:15
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2017/2/3 13:24:15
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2017/2/3 13:24:15
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