With the constant progress of electronic technologies, increasing high frequency of clock in digital system, increasingly short rising edge time, PCB system has become a system structure with high performance, far more than just a platform supporting components. From the perspective of electric performance, the interconnection between high-speed signals is no longer expedite or transparent and the influence of interconnection between leads on high-speed PCB and board plane properties can't be neglected any longer. How to successfully deal with problems of signal integrity including reflection, crosstalk, delay, calling and impedance matching caused by high-speed signal interconnection and to ensure the quality of signal transmission determines the success of the design.