whether manufacterer can manufactor board with proscribed design rules like clearance between wire to wire ,wire to pad ,wire to via ,via to via etc ,
min trace width with which he can manufacture.
min diameter via he can achieve,bcz for high density interconnect via with dia 6 or 8 mils are used,this can only achieved by only advance manufactering technology.
ability to maitain controled impedance for traces. If manufacturer can provide like these facalities then it is ok.
Luc Vercruysse
2017/6/9 15:04:26
I think you can only do simple visual checks:
1) Observe the silkscreen printing on the board layout.
2) Observe the soldermask opening alignment...you will observe some mis-registration if the quality is bad.
3) Hold the board vertically and view it from its side.check out for warpage on the board.
Ciurdar Gabriel
2017/6/9 16:23:55
Luc Vercruysse
2017/6/9 15:04:26