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We are in the process of deciding whether to change a PCB product from a single board to a 3 up panel array. Could you please advise on the most effective removal design, either scoring or snap off, taking into account that material utilisation is important to the decision. Note that these PCBs are to be leaded populated therefore require flow solder. Advice would be appreciated.
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Chao Yu
2017/5/2 9:13:16
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