Can anyone help me with a problem I am encountering on specifying the surface finish on a new BGA System in Package module. So far I have been advised to look at a palladium / nickel / gold solution but does that have any advantages over nickel / gold process. It seems more costly.
Thanks
Luca
2017/3/2 10:01:41
Bravo! Hope you can write soon.
Adair
2017/3/2 10:01:41
I certainly enjoyed reading your post.
Mikael
2017/3/2 10:01:41
Very valuable!
chrisjmears
2017/3/2 10:01:41
Many thanks. Your idea is very valuable. Will certainly share this post with my pals.