Analysis on Stack-up of 8 Layers PCB Prototype
In
the past ten years, electronic application technology developed a lot, which
led to the high requirements of PCBs. These requirements include low weight,
high speed, miniaturization and multifunction. All of these result in the
popularity of multilayer PCB, like 4
layer PCB, 6 layer PCB and 8 layer PCB. For multilayer PCB, the
stack-up plays an important role on its function. Because good multilayers
stack-up helps to build better EMC performance product. Here I would like to
introduce some useful information of stack-up of 8 layers PCB prototype.
The basic layers of 8 layers PCB prototype include ground
plane, power plane, signal layer, high speed signal layer, solder mask and
silkscreen.
The following is an
example of 8 layer PCB stackup.
Stack-up of 8 Layers PCB Prototype
In order to make the 8 layers PCB works well with good EMC
performance, every signal layer should be followed by a balance structure, such
as power plane or ground plane. Besides this, the space between every layer
should be taken seriously as well, especially the trace space between signal
layer and ground plane. Small spacing can ensure bigger coupling capacity. One
of the suggested stack-up of 8 layers
PCB prototype is: signal 1---ground plane---signal 2---power plane---ground
plane---signal 3---ground---signal4.
This stack-up of 8 layers PCB prototype used many layers
of ground plane to keep the good product performance. Good stack-up helps to
avoid signal cross talk, impedance mismatch issues.
From the above
information, we realize the importance of stack-up. Just keep in mind that the
stack-up of 8 layers PCB prototype should
be decided seriously.
