Reliability through perfect circuitry and security as no repair = no risk.

Poor repair can actually lead to open circuits being supplied. Even a ‘good’ repair has a risk of failure under load conditions (vibration etc.) leading to potential field failures.

Improved cleanliess of the PCB influences increased reliability.

Residues on the boards, solder pick up, risk of conformal coating problems, ionic residues leading to risk of corrosion and contamination of the surfaces which are used for soldering – both potentially leading to reliability issues (poor solder joint / electrical failures) and ultimately increased potential for field failures.

Solderability, reliability and less risk of moisture ingression.

Solderability problems can occur as a result of metallurgical changes within the finish of old boards, whilst moisture ingression can lead to delamination, inner layer separation (open circuits) during assembly and/or when in the field.

Increased reliability and known performance.

Poor mechanical properties mean the board doesn’t perform as expected under assembly conditions – for example: higher expansion properties leading to delamination / open circuits and also warpage problems. Reduced electrical characteristics can lead to poor impedance performance

Strict control of dielectric spacing provides less deviation in electrical performance expectations.

Electrical characteristics may not be exactly as planned and units within the same batch can demonstrate greater variation in output / performance.

ALLPCB recognizes ‘good’ ink to provide security and ensures solder mask inks meet UL standards.

Inferior inks can cause adhesion, resistance to solvents and hardness problems. All of these problems can lead to the solder mask to detach from the board and eventually cause corrosion of the copper circuit. Poor insulation properties can cause short circuits due to unexpected electrical connectivity / arc.

Tighter tolerances means improved dimensional quality of the product – improved fit, form and function.

Problems during assembly such as alignment / fit (press fit pin problems that are only found when the unit is fully assembled). In addition, there is a problem in mounting the base due to an increase in dimensional deviation.

Better electrical insulation, less risk of flaking or loss adhesion and greater resilient to mechanical impact – wherever the mechanical impact occurs!

Thin soldermask can cause adhesion,resistance to solvents and hardness – all of which can see soldermask coming away from the board ultimately leading to corrosion of copper circuitry. Poor insulation characteristics due to the thin deposit can lead to short circuits through unwanted electrical continuity / arcing.

Care and careful care in the manufacturing process to create safety.

A variety of scratches, minor injuries, repairs and repairs - the board can be used but not good looking. In addition to the problems that can see from surface, what are the invisible risks, the impact on assembly, and the risks in actual use?

The benchmark for peelable mask – no ‘local’ or cheap brands.

Inferior or inexpensive peelable may foam, melt, crack or simply set like concrete during assembly, so that the peelable cannot be peeled off/inactive.

No partial assembly means improved efficiency for the customer.

Special set-ups are necessary for each panel with a defect, and if the x-outs are not clearly marked or not segregated from the main delivery, there is a risk of assembling a known bad board; waste of components and time.