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Home > News > Detail

FR4 Material Upgrade—New Tg150 Covered ALLPCB Prototype

2020-09-11  ALLPCB Team
Read:3658

An upgrade of FR4 material——Kingboard Tg150 now fully applied to ALLPCB prototype, as before Shengyi Tg140 is widely used.

 

What is Tg?

Glass transition temperature, which is known as Tg, is the gradual and reversible transition in amorphous materials (or in amorphous regions within semicrystalline materials) from a hard and relatively brittle "glassy" state into a viscous or rubbery state as the temperature is increased.[1]


The glass-transition temperature Tg of a material characterizes the range of temperatures over which this glass transition occurs. It is always lower than the melting temperature, Tm, of the crystalline state of the material, if one exists.


The printed circuit board should be burning-resistant in the manufacturing process and more important, keep the stability of board dimension (X, Y, Z). It can’t be burned at a certain temperature and only be softened. The temperature point is called the glass transition temperature (Tg).


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What’s the difference between Tg140 and Tg150?

High Tg materials are mostly used in multilayer printed circuit boards (≥10 layers), automobiles, packaging materials, embedded substrates, precision instruments for industrial control and other fields. The higher Tg value, the better the performance of PCB heat resistance, moisture resistance, chemical resistance, stability and other characteristics

  • Better performance

  • Resistance to higher temperatures

  • Longer delamination durability

  • Lower thermal expansion

  • Better mechanical and chemical resistance to heat and moisture


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What’s the advantage of ALLPCB’s KB Tg150?


  • Lead-Free/Tg 150/Low CTE (Feature) :                        

        Tg>150°C Lead-free DSC Tg>150°C                                    

              Excellent thermal reliability                                                   

         Low Z-CTE                                                                            

         Anti-CAF capability                                                                

  • Application

        Computer and NB

        Instruments

        Consumer electronics

        Automotive electronics


ALLPCB is always committed to providing the best product and excellent experience to our valued customers.





[1] Dyre, Jeppe C. (2006). "Colloquium : The glass transition and elastic models of glass-forming liquids". Reviews of Modern Physics. 78 (3): 953–972. doi:10.1103/RevModPhys.78.953ISSN 0034-6861.

 





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