Component Placement Tips and Strategies
Component placement is an electronics manufacturing process that places electrical components precisely on printed circuit boards to create electrical interconnections between functional components and the interconnecting circuitry in the PCBs. The component leads must be accurately immersed in the solder paste previously deposited on the PCB pads.
There, I prepare some component placement tips and strategies. It will help to know what you should pay attention to when you place components in electronics manufacturing process. Following are component placement rules：
In a highly sensitive circuit, the critical components are placed in the first and in such a way that a minimum length of the critical conductor is required.
In a less critical circuit, the components are arranged in the order of the signal flow. This will result in a minimum conductor length.
In a circuit where several components have considerably more connections than others, these critical components must be placed first and the rest are grouped around them.
The general rule is to place the first component. Its position is fixed to the final fitting and interconnects, such as connectors, heat sinks, etc. Then place the components connected to these fixed components.
The components should be placed in a 2.5 mm grid.
In the component, the larger components are placed in the first and middle spaces filled smaller.
All components should be placed in such a way that other components of the disorder are not necessary if they need to be replaced.
Components should be placed in rows or columns if you want to give a good overview.
