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4 Layers Off-price PCB Prototype
Only$33.81/10pcsView Quoting DemonstrationStandard Specification
Layers 4 Layers Dimensions 100mm X 100mm Material FR4-TG TG 130-140 Quantity 10 pcs Thickness 1.6 mm Min Hole Size 0.3 mm Surface Finish HASL with lead Finished Copper 1 oz Cu Min Track/Spacing 6/6mil -
6 Layers Off-price PCB Prototype
Only$101.43/10pcsView Quoting DemonstrationStandard Specification
Layers 6 Layers Dimensions 100mm X 100mm Material FR4-TG TG 130-140 Quantity 10 pcs Thickness 1.6 mm Min Hole Size 0.3 mm Surface Finish HASL with lead Finished Copper 1 oz Cu Min Track/Spacing 6/6mil -
8 Layers Off-price PCB Prototype
Only$376.14/10pcsView Quoting DemonstrationStandard Specification
Layers 8 Layers Dimensions 100mm X 100mm Material FR4-TG TG 130-140 Quantity 10 pcs Thickness 1.6 mm Min Hole Size 0.3 mm Surface Finish HASL with lead Finished Copper 1 oz Cu Min Track/Spacing 6/6mil
PCB Prototype Capability
| Specification | Standard Specification | Customized Specification |
|---|---|---|
| Layers | 1-12 Layer | 1-40 Layer |
| Material | fr-4 | Rogers, Normal Tg FR4, Normal Tg FR4 (Halogen Free), High CTI, High Tg FR4, Ceramic Filled High-frequency Material, PTFE High-frequency Material, Hybrid Material |
| Thickness | 0.8-1.6mm | 0.2-6.0mm |
| Copper Weight | 35μm | 0.5oz-14oz |
| Trace/Spacing | 6mil | 2mil |
| Min. Hole Size | 0.3mm | 0.1mm |
| Delivery Time | 4 Days (Double-sided) | 1 Day (Double-sided) |
| Surface Finish | HASL/ HASL Lead Free | Immersion Gold, Hard Gold Plating (Ni/ Ni Free), Gold Finger, HASL, OSP, ENEPIG, Soft Gold Plating (Ni/ Ni Free), Immersion Sliver, Immersion Tin, ENIG+OSP, ENIG+G/F, Gold Plating+G/F, Immersion Tin+G/F |
| Test Standard/Certificate | IPC-A-600H | IPC-A-600H \IPC-A-610E \GB4588ISO9001,ISO14001,UL,TS16949,OHSAS18001,CQC,GJB9001 |
| See More>> | ||
Why choose ALLPCB for PCB prototype manufacturing?
Strict Quality Control
- 1. Certified by the quality control system specially for military, communications, automotive, medical, power, industrial control, security, etc.
- 2. Certified by ISO9001,CQC
- 3. Strict accordance with IPC standards and customers’ demands to ensure the high quality of PCBs
- 4. Strict implementation of quality PDCA process, improve the performance of our multilayer PCBs
Advanced Technology
- 1. Max. Layer: 40 layer; Min. Track/Spacing: 3/3 mil; Aspect Ratio: 13:1; Thickness: 6.5 mm; Max .Dimension: 500*900 mm
- 2. High-precision mechanical and laser depth controlled technology, to achieve multi-stage slot and meet the different assembly demands
- 3. High-precision tooling lamination technology and mature hybrid lamination technology, to achieve the hybrid of FR-4, PTEE and high frequency materials
Top Technical Capacity
- 1. Professional team with more than 100 experienced technicians, offering you the best service
- 2. One-to-One customer service for every customer to offer instant tracking and ensure excellent quality and service
- 3. Powerful IT support to optimize the production quality and efficiency
Advanced Test Equipment
- 1. Imported equipments like automatic plating line, Orbotech LDI, BURKLE laminator, Mitsubishi laser driller, SCHMOLL driller, vacuum resin filling machine and Anderson modeling machine, to meet the production demands of multilayer and high- precision PCBs
- 2. 100% AOI test to reduce the defects in electronic test
- 3. More than 20 high test equipments like reflow soldering, thermal shock, high power microscope, RoHS tester, hole cooper thickness tester, impedance control tester, and Au Ni thickness tester, etc.
Top Raw Material Supplier
- 1. Established long-term strategic cooperation with top raw material suppliers like ROGERS, TACONIC, ARLON, ISOLA, Bergquist, Shengyi and ITEQ, etc.
- 2. ROHMHAAS plating liquid, HITACHI dry film, TAIYO ink
Cases of Multilayer Printed Circuit Boards
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Layer: 4 layers
Dimension: 24*45 mm
Track/Spacing: 10/7 mil
Surface Finish: Immersion Gold
Material: FR-4
Thickness: 1.6 mm
Features: Partial Buried Copper
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Layer: 4 layers
Dimension: 88*100 mm
Track/Spacing: 25/22 mil
Surface Finish: HASL
Material: FR-4
Thickness: 0.6 mm
Features: Rigid-flex PCB,
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Layer: 6 layers
Dimension: 100*150 mm
Track/Spacing: 4.5/3.5 mil
Surface finish: Immersion Gold
Material: FR-4/ DuPont Flexible PCB
Thickness: 0.7 mm
Features: HDI + Rigid-flex PCB
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Layer: 6 layers
Dimension: 94*72 mm
Track/Spacing: 8/5.39 mil
Surface Finish: Plating Gold + Gold Finger
Material: FR-4
Thickness: 1 mm
Features: Gold Finger, Partial Thick Copper,
5G High Frequency -
Layer: 8 layers
Dimension: 114*59 mm
Track/Spacing: 2.76/3.5 mil
Surface Finish: Immersion Gold
Material: FR-4
Thickness: 1.6 mm
Features: HDI – Stacked Via
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Layer: 8 layers
Dimension: 26*42.6 mm
Track/Spacing: 5.5/5 mil
Surface Finish: 1.5 mm
Material: FR-4+ROGERS4350
Thickness: 1.5 mm
Features: High Frequency Stepped Multilayer PCB,
3-step Stepped Slot -
Layer: 8 layers
Dimension: 147*191 mm
Track/Spacing: 6/6 mil
Surface Finish: Immersion Gold
Material: DuPont Flexible PCB/FR-4
Thickness: 3 mm
Features: Rigid-flex PCB, 2nd Mechanical Buried Via
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Layer: 10 layers
Dimension: 232*254 mm
Track/Spacing: 3.8/3.7 mil
Surface Finish: Immersion Gold
Material: FR-4
Thickness: 2 mm
Features: HDI
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Layer: 12 layers
Dimension: 175*240 mm
Track/Spacing: 5/5 mil
Surface Finish: Immersion Gold
Material: FR-4/PTFE
Thickness: 3.5 mm
Features: FR-4 + High Frequency Hybrid Lamination
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Layer: 16 layers
Dimension: 500*74 mm
Track/Spacing: 3.94/3.8 mil
Surface Finish: Immersion Gold
Material: DuPont Flexible PCB/FR-4
Thickness: 2.2 mm
Features: 16 layers Rigid-flex Multi-layer PCB,
Separate Flexible PCB Design, Large Dimension -
Layer: 22 layers
Dimension: 422*855 mm
Track/Spacing: 4/4 mil
Surface Finish: Immersion Gold
Material: FR-4
Thickness: 3.0 mm
Features: Multi-layer, Large Communication Backplane
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Layer: 22 layers
Dimension: D310 mm
Track/Spacing: 5/5 mil
Surface Finish: Immersion Gold
Material: FR-4
Thickness: 4.0 mm
Features: Multilayer Board, Depth Controlled Back Drill
