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How to Fabricate Advanced PCB?

Advanced PCB

Limited time event
  • 2 Layers

    Material Layers
  • 100*100mm

    Dimensions
  • 1.6mm

    Thickness
  • 5pcs

    Quantity

$13.44

Activity price
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Test Report

When the QTY of advanced PCB is 30pcs or above, test report will be free and sent with the package acquiescently

  • FINAL INSPECTION REPORT
  • MICROSECTION INSPECTION REPORT
  • SOLDERABILITY TEST REPORT
  • ElECTRIC TEST REPORT

JP-2Y2079995

Order Number
  • FR-4 Kingboard tg130

    Material
  • 1.6±0.16MM

    Thickness
  • ≤0.75%

    Twits
  • No Peeling

    Solder Mask tape Test

JP-2Y2079995

Order Number
  • MI Requirment≥20um

    Hole Wall Cu
  • ≥1-40um

    Solder Thickness
  • ACC

    Plating Void
  • ACC

    Plating Crack

J2Y-2436190

Order Number
  • 260±5℃

    Temperature
  • ACC

    Wettability
  • ACC

    Hole Void
  • ACC

    Solder Mask Blister

J2Y-2436190

Order Number
  • 250V

    Test Voltag
  • 100MA

    Test Current
  • 20Ω

    Conductive Resistance
  • 30MΩ

    Insulation Resistance
Comparison of Parameters

Category

  • Thickness tolerance
  • Welding resistance alignment accuracy
  • Silkscreen accuracy
  • Copper thickness
  • Hole wall roughness
  • Conductor width/spacing tolerance
  • Contour /V cut dimensional tolerance
  • Weldability
  • Thermal impact capacity

Advanced PCB

  • (0.5~0.8)±0.085mm (0.9~1.2)±0.115mm (1.6~2.0)±0.135mm
  • ±0.06mm
  • ±0.15mm
  • 20μm+6/-0μm
  • ≤23μm
  • ≤0.1mm±15%
  • ±0.13mm
  • 260±5℃/5s×1 time. Good wetting, solder paste has good adhesion
  • 288±5℃/10s×3 times. No stratification, no bubble

Standard PCB

  • (0.6~0.8)±0.1mm (0.9~1.2)±0.125mm (1.6~2.0)±0.15mm
  • ±0.075mm
  • ±0.175mm
  • 18μm+7/-0μm
  • ≤25.4μm
  • ≤0.1mm±20%
  • ±0.15mm
  • 260±5℃/5s×1 time. Good wetting, solder paste has good adhesion
  • 288±5℃/10s×3 times. No stratification, no bubble
Advanced PCB Cases

Click the pictures for more details

  • Single-layer Immersion Gold PCB
  • Double-layer Immersion Gold PCB
  • Double-layer Immersion Gold Circuit Board
  • Specifications
  • Layers: 4
  • Thickness: 3.0mm
  • Material: FR4 S1000-2
  • Size: 175*104mm
  • Surface treatment: Immersion gold
  • Line width/spacing: 12/12mil
  • Minimum aperture: 0.5mm
  • Solder mask color: photosensitive green
  • Finished copper thickness: inner layer 6 OZ, outer layer 6 OZ
  • Specifications
  • Layers: 2
  • Thickness: 1.6mm
  • Material: FR-4 Goldenmax TG130
  • Size: 171.4*222.1mm
  • Surface treatment: Immersion gold
  • Line width/spacing: 8/8mil
  • Minimum aperture: 0.4
  • Solder mask color: green
  • Finished copper thickness: 1 OZ
  • Specifications
  • Layers: 2
  • Thickness: 1.6mm
  • Material: FR-4 Guoji TG130
  • Size: 145*206mm
  • Surface treatment: Immersion gold
  • Line width/spacing: 10/10mil
  • Minimum aperture: 0.4
  • Solder mask color: green
  • Finished copper thickness: 1 OZ
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