BGA Group | ALLPCB

Category:PCB BGA

Group Administrators: 1 | Group Member: 102 | Group Threads: 97

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter.

Community > Groups > BGA

Search Results: 97 Threads，10 Pages Submit Project

0 comments

3804 views

BGA Rework Methods and Machine

As you are aware the common method to rework BGA is : 1. Remove BGA with hot air reflow machine ( SRT as current practice) 2. Clean the BGA pad using solder iron and solder wick. 3. Replace BGA with S...(view more)

Javier Martínez

2017/5/9 22:42:07

4 comments

3379 views

BGA Placement

Has anyone ever placed and reflowed a 1.27mm PBGA to 6 mil poly flex bonded to aluminum? If so what is the life expectancy of the solder joints?(view more)

michal.kozlok

2017/5/1 11:11:41

1 comments

3621 views

BGA testing - Xray

We are starting to use high count BGAs (512). Is there an industry standard on how to inspect the BGAs. Should all BGAs be inspected with Xray equipment or is there other solutions? Thank you(view more)

Benedict

2017/4/27 1:52:54

4 comments

3367 views

Local fiducials

Hi everyone, here a question for the SMT production engineers... is possible today mount the fine pitch and ultrafine pitch devices (BGA, QFP, CSP), without using the local fiducials, but using the th...(view more)

Fabio Ricci

2017/4/23 18:17:01

5 comments

3643 views

BGA Information Needed

I am looking for some general information with respect to BGA devices on circuit boards. I work for an automation company and am curious to know who's doing what with BGA placements, specifically the ...(view more)

efem elec. co.

2017/4/21 14:51:28

3 comments

3559 views

BGA ball seperation

I have an assembly that uses several different BGA packages. During troubleshooting we have found that some of the balls in the corners of the BGA's are separated from the underside of the package. Th...(view more)

juan

2017/4/16 9:08:37

1 comments

3699 views

Double-Sided BGA Process

Hi All, Ok, now i have hit a brick wall with our design department and due to limited space on our standard sized boards we are going down the Double-Sided route. We have a 8 zone (4 Top/B...(view more)

Erivando Sena

2017/4/14 2:50:05

1 comments

3551 views

To rework BGA socket

Hey All you Einsteins out there!! I gotta' problem...('course you do Steve, or you wouldn't be bugging the TechNet now would you?) I had a phone call from a acquaintance of mine wanting to bring...(view more)

tim

2017/3/1 5:41:39

1 comments

3250 views

Problems on BGA Voiding

We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the ...(view more)

Jorge Arizaga

2017/3/1 5:23:00

1 comments

3363 views

Anyone knows how to do BGA/CSP rework?

Hi Has anyone tried rework of lead-free assemblies? Any issues? Is there a solution for achieving high temperatures without adversely affecting board and component, considering the fact that hig...(view more)

geovannefurriel

2017/3/1 4:04:03

Hot Groups

PCB Manufacturing

Group Member: 320

Group Threads: 440

Join
PCB Assembly Service

Group Member: 279

Group Threads: 384

Join
PCB Industry Information

Group Member: 167

Group Threads: 368

Join
Component Learning

Group Member: 367

Group Threads: 356

Join

New Groups

ALLPCB "Useless" Design Competition

Group Member: 30

Group Threads: 105

Join
ALLPCB Updates

Group Member: 32

Group Threads: 4

Join
Electronics

Group Member: 784

Group Threads: 22

Join
Drones

Group Member: 35

Group Threads: 13

Join